印制电路板（PCB）工程制程能力:
| 项目 Item | 制 程 能 力 Manufacturing Capabilities | | 基板类型 Base Material | FR-4、CEM-3、铝基板、陶瓷基板、Teflon板 FR-4、CEM-3、AL-based、Ceramic-based、PTFE | | 最小成品孔径 Min. Finished Hole | 0.2mm | | 最小线宽/线距 Min. Track/Space | 4mil/3.5mil | | 铜箔厚度 Copper Thickness | 0.5~5OZ | | 成品板厚 Finished Thickness | 0.3~4.0mm | | 最高层数 Max. Layers | 18 | | 表面涂覆类型 Finished Surface | 喷锡、防氧化、化学镍金、化银、化锡 HASL、OSP、ENIG、 Immersion Silver、Immersion Tin | | 特性阻抗 Characteristic Impedance | 28±3Ω 、50±5Ω、 60±6Ω、 75 ±8Ω、100 ±10Ω |
Flexible printing circuit (FPC) engineering FPC factory makes good use of client group advantage of Huaxin Group, and specializes in manufacturing relative accessories and soft-hard boards of various single, double-side/piercing/multilayers FPC. Critical dimension 0.06mm; min aperture 0.20mm; Product quality accords with national standard and IPC standard, and is UL certified. FPC factory enjoyed capacity of 12,000sq.m per month in 2006, 20,000sq.m per month in 2007, and 30,000sq.m per month in 2008. FPC factory is aimed at being NO.1 FPC factory of China |
